Kyocera Ceramic Packages

Hermetic or vacuum sealing is typically applied to ensure device quality.

Kyocera ceramic packages.

Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Kyocera international utilizes the inherent hermetic capabilities of ceramic materials in the production of its image sensor and mems packages. Kyocera international s advances in package manufacturing technology new materials and software design and simulation tools helped our customers to achieve the benefit of greater degrees of freedom for device and circuit design and most importantly helped our customers be the impetus for growth in the microelectronics industry. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials.

Material properties of typical multilayer ceramics are as follows. Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. Our sensor mems packages are cost effective solutions to a wide variety of applications such as digital cameras automotive rf military video displays scanners toys and various medical applications.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Kyocera provides design engineering support for custom products such as multi chip module mcm. Its intermediate coefficient of thermal expansion cte is closely matched with gaas and si devices. Kyocera uses alumina al 2 o 3 and aluminum nitride aln ceramics to produce multilayer packages and single layer submounts for high power high brightness light emitting diodes leds multilayer alumina ceramic packages are available with a copper cu heat slug for superior heat dissipation.

Kyocera offers a wide variety of ball grid arrays bgas ranging from c bgas and kyocera s original high reliability dimpled bgas d bga to hitce bgas with customizable thermal expansion. Bga packages are well suited for high frequency applications and where increasing functional integration requires high density routing and a large number of. Kyocera develops and provides a wide variety of ceramics for package applications. Beo is also used in to xxx packages for high current and high voltage.

For mems packages vacuum sealing and getter utilization may be required and is available through kyocera international s assembly technology division.