103 this ceramic has also been machined by lavrinovich et al.
Laser milling of ceramic components.
Using state of the art laser systems we have developed processes that allow us to machine precise features without cosmetic defects such as microcracks or heat affected zones.
Reducing the traverse speed avoided fracture of the ceramic and it was more effective than increasing the laser power for machining thicker plates 6 8 mm.
102 firestone et al.
Used a 15 kw co 2 laser to machine silicon nitride without fracturing at 996 c and the machining rates achieved were ten times that of conventional diamond grinding.
Conventional technologies for the manufacture of ceramic components are based on sintering processes.
Laser milling provides a new method of producing parts in a wide range of materials including ceramics directly from cad data.
Recently the lam method termed excimer laser assisted chemical machining which uses a krypton fluoride krf laser with a 248 nm wavelength was used to intensify and improve surface integrity in machining sic ceramic.
When cutting or dicing ceramic wafers we achieve extremely high edge quality without raised edges or chipping along the cut.
Conventional methods of producing ceramic components are based on sintering technology which requires expensive tooling making it uneconomic for small batch fabrication.
Request pdf laser milling of ceramic components conventional methods of producing ceramic components are based on sintering technology which requires expensive tooling making it uneconomic for.
Laser milling of ceramic components 1.
This paper considers the technical capabilities of laser milling when applied to the machining of microcomponents from alumina and silicon nitride ceramics.
Physical factors affecting the process.